Typically, products of surface mount contract manufacturing are smaller and more affordable, making them a more popular choice over the through-hole method. The three-hole method is actually quite old and with this, larger circuit boards with drilled holes are needed where in comparison using the surface mounted method, solder and two-in-one glue are used that eliminate holes. As a result, this creates more reliable electronic connections.
In looking at the difference between through-hole and surface mount contract manufacturing there are a number of specific things to consider. For one, components of surface mount are smaller. The only restriction to component size is current miniaturization technology.
With surface mounted contract manufacturing, components as small as 0.4×0.2 millimeters can be hosted and according to experts, there is a new generation of standards whereby size will get even smaller. Because of this, engineers will have the ability to add more features onto the circuit board to accommodate smaller sizes of devices. With technology focusing on smaller handheld devices, this is critical to future technology.
Another comparison between through-hole and surface mount contracting manufacturing is that the latter makes it possible to print on both sides of a circuit board. With the older through-hole method, components could only be manufactured on one side of the board but being able to use both greatly expands opportunity. This ensures a higher density capable of accommodating a smaller device.
Surface mount contract manufacturing is also more beneficial because it offers much faster setup. The setup assembly line even when making numerous variations on a single product is faster. In addition, this method is superior because it eliminates defective products often seen with the through-hole methodology.
By being able to manufacture high quality boards in less time, there is a reduction of cost specific to labor before and after production. Even prototypes of boards made with the Surface Mount Assemblies are less expensive. Because of this, multiple prototypes can be designed prior to engineers making a commitment on the final product.
There is also less electronic interference with the surface mounted contract manufacturing method. The number of open wires with this method are minimizes, which in turn makes products more resistant to interference but also the effects of RF signals.
One of the most annoying problems a consumer faces is having a device with constant electronic interference. Therefore, the surface mounted contract manufacturing method ultimately ensures a happier end-user as well.