How PCB Inspections Benefit the Product Manufacturing Process

Even with the most impressive PCB assembly system in place, the job is not done until a thorough inspection is completed. It is an important aspect of the printed circuit board assembly process. Even with quick turn PCB assembly, hidden defects can occur. It might seem obvious, but the earlier these defects are discovered the better. This can protect your business from costly overages if these issues are not addressed.

At Star Engineering, we pride ourselves on our end-to-end services with printed circuit board manufacturing. We are engaged in every aspect of your project, including:

  • Engineering
  • Product Design
  • New Product Introduction
  • Product Inspection

Inspection Details

As a top-level PCB assembly USA, we provide all necessary PCB assembly inspections. There are many types of inspections, however the most common are found below:

  • Manual PCB Inspection
  • AOI PCB Inspection
  • AXI PCB Inspection
  • X-Ray Inspection

Manual PCB Inspection

With manual PCB inspection, as the name suggests, this simply involves inspection staff checking the various PCB assemblies for problems.

AOI PCB Inspection

This is an automated procedure. AOI stands for automated optical inspection. This procedure utilizes an optical system which takes a high-quality, digital image of the assembly to note any anomalies.

AXI PCB Inspection

Unfortunately, as the density of printed circuit boards increases, not all solder points are clearly visible. Due to this, some inspections utilize an x-ray system noted as an AXI. By using this system, inspectors can view the solder joints.

X-Ray Inspection

The more complex the board, the more difficult it is to use either manual or AOI inspection techniques. With X-ray inspection, there is no problem revealing bubbles and other defects not detected with other techniques.

Various Defects Inspection Techniques Can Detect

There are various defects which can greatly affect a printed circuit board’s functionality. Some of the most common are described below:

  • Blind Vias
  • BGA
  • Capacitor Decoupling
  • Solder Voids

Blind Vias

Using vias in quick turn PCB assembly technology is commonplace. They can help the various layers of the circuit board to be connected easily. Due to the nature of blind vias, they cannot be detected with visual inspections.


Ball grid array systems allow components to be packed with high density. The quality inspection technique best utilized to detect problems with the BGA are X-rays.

Capacitor Decoupling

The use of decoupling capacitors can help stabilize otherwise unstable power supply to the PCB. However, if placed in correctly, it can lead to subpar performance of the PCB components. This can typically be handled by a simple visual inspection.

Solder Voids

Effective soldering connects components on the board. It is important they are done properly.

When working with custom quick turn PCB assembly manufacturing, it is vital to have quality inspections.

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